Wire Bond Inspection AI

Add a real-time inspection layer to every wire bond with vision AI for wire bond inspection. Built for the packaging floors where a bond wire is thinner than a hair and one device carries three hundred of them, a lifted bond passes electrical test today and opens a thousand thermal cycles from now, and everything you could have seen disappears under mold compound at the next station. Whether you're running ball bonders, wedge bonders, or die attach, Roboflow inspects every bond, loop, and fillet at line rate, with per-lot records behind every device.

Bonds and Balls:

• Catch lifted, missing, and off-pad bonds on every device, not the sampled few
• Judge ball size, shape, and placement against the pad, and wedge bond condition on every stitch
• Flag tails, splash, and pad contamination before the next wire goes down

Wires, Loops, and Die Attach:

• Detect wire sweep, sagging loops, and wires crossed or touching before mold compound makes it permanent
• Hold loop shape consistency across devices, bonders, and recipes
• Verify die attach fillet coverage and epoxy bleed, so the die under the wires is as right as the wires

Lines, Bonders, and Systems Integration:

• Run MIL-STD-883-style visual criteria consistently, on every device instead of an inspector's sample
• Trend findings by bonder, capillary, and wire spool, so a wearing capillary shows up in ball shapes before it shows up in pull-test failures
• Route devices in real time through factory host and MES integration, with per-lot records that support MIL-STD-883, AEC-Q100, and IATF 16949 documentation

Bring intelligence to every bond today. Stop bond defects from becoming time-zero escapes, thermal-cycle failures, or the field return in a package nobody can open.

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More About Wire Bond Inspection

What is wire bond inspection with Vision AI?

Wire bond inspection with vision AI uses computer vision models to inspect wire bonds through packaging: lifted, missing, and off-pad ball and wedge bonds, ball size, shape, and placement, wire sweep, sagging, and crossed wires, tails and pad contamination, and die attach fillet and epoxy bleed condition. Models trained on your actual devices inspect every unit before molding, with per-lot records that support MIL-STD-883, AEC-Q100, and IATF 16949 documentation.

Can Vision AI see defects in wire thinner than a hair?

The bond wire is the scale hard case: gold and copper wire down to tens of microns, hundreds of bonds per device, gold balls on gold pads with almost no contrast, and loop geometry that has to be judged in three dimensions from imagery. Deep-learning models trained on your actual devices, packages, and optics learn each recipe's normal ball, stitch, and loop, flag the bond that breaks the pattern, hold that judgment across bonders and package types, and route uncertain devices to review instead of guessing, at magnifications where a human inspector's day is measured in eyestrain.

Does this replace pull and shear testing?

No. Pull and shear tests keep owning bond strength; they are the destructive record, run on sampled devices and sacrificed coupons. Vision AI adds the 100% visual layer those samples can't give you: the lifted bond on a device that was never going to be pulled, the off-pad ball electrical test passes at time zero, the swept wire that fails only at temperature, on every device instead of the sacrificed few. Pull data and visual findings land in the same per-lot record, and a drifting trend in ball shapes often reaches the bonder before the pull tester sees it.

Can it integrate with our bonders, factory hosts, and MES?

Yes. Roboflow Inference exposes a standard API and supports common industrial protocols, so wire bond inspection events flow into your existing systems: bonder and line controllers, factory hosts alongside SECS/GEM equipment integration, MES and ERP platforms like SAP and Oracle, and SCADA and HMI platforms like Ignition and AVEVA, through REST, MQTT, OPC UA, and direct database writes. PLC-level integration holds a magazine or routes a device the moment a check fails, and every event carries lot, device, bonder, imagery, and disposition, with a full audit trail behind every shipment.

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